Industry Description
This Sub-class includes the manufacture, repair and/or maintenance of semiconductor assembly and/or packaging machinery.
Keywords
Burn-in board and system, standard and custom design, manufacturing
Burn-in board and system, standard and custom design, repair and maintenance
Computer burn-in system manufacturing
Computer burn-in system repair and maintenance
Semiconductor assembly and packaging machinery, manufacturing
Semiconductor assembly and packaging machinery, repair and maintenance
Semiconductor assembly and testing machinery manufacturing
Semiconductor assembly and testing machinery repair and maintenance